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PCFF55H120SWF Datasheet(PDF) 1 Page - ON Semiconductor |
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PCFF55H120SWF Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 4 page ![]() DIE DATA SHEET www.onsemi.com © Semiconductor Components Industries, LLC, 2022 December 2022 − Rev. P0 1 Publication Order Number: PCFF55H120SWF−DIE/D Diode – Power, Bare Die Gen VII, Fast Recovery 1200 V, 55 A PCFF55H120SWF Features • Advanced Gen VII Technology • Fast and Soft Recovery • Maximum Junction Temperature 175°C • Low Forward Voltage: VF = 1.78 V (Typ.) @ IF = 55 A • Easy to Parallel Operation Typical Applications • Solar • Energy storage • Industrial motor control MECHANICAL PARAMETERS Parameter Value Unit Die Size (w/ Scribe Lane) 3,400 x 6,400 mm2 Anode Pad Size 2,437 x 5,437 mm2 Scribe Lane Width 80 mm Die Thickness 119 mm Top Metal 6 mm AlSiCu Back Metal 1.65 mm Ti/NiV/Ag Topside Passivation Silicon Nitride plus Polyimide Wafer Diameter 200 mm Max Possible Die Per Wafer 1145 Recommended Storage Environment In original container, in dry nitrogen, < 6 months at an ambient temperature of 23°C Device Inking Shipping ORDERING INFORMATION PCFF55H120SWF Yes Sawn Wafer on Tape DIE OUTLINE VR = 1200 V IF = 55 A DIODE DIE C A |
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