TLP3149

1

Photocouplers Photorelay

TLP3149

TLP3149

TLP3149

TLP3149

Start of commercial production

2018-07

1.

1.

1.

1. Applications

Applications

Applications

Applications

•

ATE (Automatic Test Equipment)

•

Measuring Instruments

•

Factory Automation (FA)

•

I/O Interface Boards

•

Mechanical relay replacements

2.

2.

2.

2. General

General

General

General

The TLP3149 photorelay consists of a photo MOSFET optically coupled to an infrared light emitting diode. It is

housed in a 4-pin package with 2.54-mm lead pitch and 2.1-mm height. The low on-state resistance and the high

permissible on-state current make it suitable for power line control applications.

3.

3.

3.

3. Features

Features

Features

Features

(1)

Package: SOP (2.54SOP4) (Height 2.1 mm, pitch 2.54 mm)

(2)

Normally opened (1-Form-A)

(3)

OFF-state output terminal voltage: 100 V

(4)

Trigger LED current: 3 mA (max)

(5)

ON-state current: 1.5 A (max)

(6)

ON-state resistance: 200 mΩ (max)

(7)

Output capacitance: 160 pF (typ.)

(8)

Off-state current: 1 µA (max)@VOFF = 100V

(9)

Isolation voltage: 1500 Vrms (min)

(10) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

4.

4.

4.

4. Packaging and Pin Assignment

Packaging and Pin Assignment

Packaging and Pin Assignment

Packaging and Pin Assignment

11-5H1S

1: Anode

2: Cathode

3: Drain

4: Drain

2018-06-28

Rev.1.0

©2018

Toshiba Electronic Devices & Storage Corporation