 2019 Microchip Technology Inc.

DS20006185A-page 23

ATF1504ASV/ATF1504ASVL

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.80 BSC

MIN

E

MAX

11.40

Contact Pad Length (X20)

Contact Pad Width (X20)

Y1

X1

1.50

0.55

NOM

C1

Contact Pad Spacing

11.40

Contact Pad to Center Pad (X20)

G1

0.25

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-23019-3EB Rev A

44-Lead Plastic Thin Quad Flatpack (3EB) - 10x10x1.0 mm Body [TQFP]

Atmel Legacy Global Package Code AIX

C1

C2

E

X1

Y2

G1

SILK SCREEN