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SSX35 Trusted platform module (TPM)
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Figure 7-1 package drawing
Notes:
(
1) This drawing is for general information only. Please refer to JEDEC
Drawing MO-153, Variation DB for additional information.
(
2) Dimension D does not include mold Flash, protrusions or gate burrs.
Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm
(0.006 in) per side.
(
3) Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)
per side.
(
4) Dimension b does not include Dambar protrusion. Allowable