AP22916

Document number: DS44758 Rev. 1 - 2

4 of 32

www.diodes.com

March 2022

© Diodes Incorporated

AP22916

Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Ratings

Unit

ESD HBM

Human Body Model ESD Protection

2

kV

ESD CDM

Charged Device Model ESD Protection

1

kV

VIN

Input Voltage

-0.3 to 6

V

VOUT

Output Voltage

-0.3 to 6

V

VON

ON Voltage

-0.3 to 6

V

ILOAD

Maximum Continuous Load Current

2

A

ILOAD

Maximum Pulse Load Current, Pulse <300µs, 2% Duty Cycle

2.5

A

TJ

Maximum Junction Temperature

+125

°C

TST

Storage Temperature Range

-65 to +150

°C

PD

Power Dissipation

510

mW

RθJA

Thermal Resistance, Junction to Ambient (Note 4)

195

°C/W

RθJC

Thermal Resistance, Junction to Case (Note 5)

38

°C/W

TLEAD

Maximum Lead temperature (10-s soldering time)

260

°C

Notes:

4. The JEDEC high-K (2s2p) board used to derive this data was a 3 inch x 3 inch, multilayer board with 1oz internal power and ground planes with 2oz

copper traces on top and bottom of the board.

5. Thermal resistance from junction to case.

Caution:

Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be

affected by exposure to absolute maximum rating conditions for extended periods of time.

Recommended Operating Conditions (@ TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Min

Max

Unit

VIN

Input Voltage

1.3

5.5

V

VON

ON Voltage Range

0

5.5

V

VOUT

Output Voltage

1.3

5.5

V

IOUT

Output Current while Vin

≧1.5V

0

2.0

A

Output Current while Vin

≦1.5V

0

1.0

A

VIH

ON High-Level Input Voltage

1.0

5.5

V

VIL

ON Low-Level Input Voltage

0

0.35

V

TA

Operating Ambient Temperature

-40

+85

°C