MCP73853/55

DS21915A-page 20

 2004 Microchip Technology Inc.

10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

Exposed Pad Width

Exposed Pad Length

Lead Length

*Controlling Parameter

Lead Width

Drawing No. C04-063

Notes:

Exposed pad dimensions vary with paddle size.

Overall Width

D2

E2

L

b

D

.016

.012

.008

.047

.055

.010

Number of Pins

Standoff

Lead Thickness

Overall Length

Overall Height

Pitch

e

n

Units

A

A1

E

A3

Dimension Limits

10

.000

.001

.008 REF.

.031

.020 BSC

MIN

INCHES

NOM

0.40

0.25

0.30

.020

.069

.015

.096

0.18

1.20

1.39

0.50

0.30

1.75

2.45

0.02

0.80

0.20 REF.

0.50 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

10

0.05

1.00

MAX

3.

Package may have one or more exposed tie bars at ends.

1.

Pin 1 visual index feature may vary, but must be located within the hatched area.

2.

0.90

.035

(Note 3)

(Note 3)

4. JEDEC equivalent: Not registered

Revised 05/24/04

.112

.118

.124

2.85

3.00

3.15

3.00

.112

.118

2.85

.124

3.15

--

--

--

--

E2

D

A1

A

A3

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

21

ID INDEX

PIN 1

E

L

D2

p

b

n

AREA

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED