TLK2201B, TLK2201BI

ETHERNET TRANSCEIVERS

SLLS585 − NOVEMBER 2003

18

POST OFFICE BOX 655303

MECHANICAL DATA

RCP (S-PQFP-G64)

PowerPAD

 PLASTIC QUAD FLATPACK

0,08

M

0,08

0,50

0,25

(See Note D)

Thermal Pad

Gage Plane

0,13 NOM

0

° − 7°

0,75

0,45

0,15

0,05

Seating Plane

4147711/A 10/98

0,27

33

0,17

16

SQ

48

9,80

1

10,20

7,50 TYP

49

64

SQ

0,85

0,75

11,80

12,20

1,00 MAX

17

32

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments.