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74HC245DB Datasheet(PDF) 2 Page - NXP Semiconductors

Part # 74HC245DB
Description  Octal bus transceiver; 3-state
PDF  22 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74HC245DB Datasheet(HTML) 2 Page - NXP Semiconductors

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9397 750 14502
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 January 2005
2 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
[1]
CPD is used to determine the dynamic power dissipation (PD in µW):
PD =CPD × VCC2 × fi × N+ ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑ (CL × VCC2 × fo) = sum of outputs.
4.
Ordering information
CI
input capacitance
-
3.5
-
pF
CI/O
input/output capacitance
-
10
-
pF
CPD
power dissipation
capacitance per
transceiver
VI = GND to
VCC − 1.5 V
[1] -30
-
pF
Table 1:
Quick reference data …continued
GND = 0 V; Tamb =25 °C; tr =tf = 6 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC245N
−40 °C to +125 °C
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HC245D
−40 °C to +125 °C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74HC245PW
−40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74HC245DB
−40 °C to +125 °C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
74HC245BQ
−40 °C to +125 °C
DHVQFN20
plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;
body 2.5
× 4.5 × 0.85 mm
SOT764-1
74HCT245N
−40 °C to +125 °C
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HCT245D
−40 °C to +125 °C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74HCT245PW
−40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74HCT245DB
−40 °C to +125 °C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
74HCT245BQ
−40 °C to +125 °C
DHVQFN20
plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;
body 2.5
× 4.5 × 0.85 mm
SOT764-1



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