LED LAMP

APPLICATION

SOLDERING

METHOD

SOLDERING CONDITIONS

REMARK

DIP

SOLDERING

Bath temperature: 260±5℃

Immersion time: with 5 sec

Solder no closer than 3mm from the

base of the package

Using soldering flux,” RESIN FLUX”

is recommended.

SOLDERING

IRON

Soldering iron: 30W or smaller

Temperature at tip of iron: 260

or lower

℃

Soldering time: within 5 sec.

During soldering, take care not to

press the tip of iron against the

lead.

(To prevent heat from being

transferred directly to the lead, hold

the lead with a pair of tweezers

while soldering

1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),

be careful not to stress the leads with iron tip.



2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.



Page :

5

P a n e l

(Fig.1)

L e a d w r i e s

L e a v e

a

s l i g h t

c l e a r a n c e

L e a d

w r i e s

( Fig. 2)