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831742I Datasheet(PDF) 15 Page - Renesas Technology Corp

Part # 831742I
Description  4:2 Differential Clock/Data Multiplexer
PDF  21 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

831742I Datasheet(HTML) 15 Page - Renesas Technology Corp

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©2021 Renesas Electronics Corporation
R31DS0073EU0200 July 30, 2021
831742I Datasheet
Power Considerations
This section provides information on power dissipation and junction temperature for the 831742I.
Equations and example calculations are also provided.
1.Power Dissipation.
The total power dissipation for the 831742I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 0.3V = 3.6V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VDD_MAX * IDD_MAX= 3.6V * 26mA = 93.6mW
•
Power (outputs)MAX = 46.8mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 46.8mW =
93.6mW
Total Power_MAX = 93.6mW + 93.6mW = 187.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for devices is 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 87.8°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.187W * 87.8°C/W = 101.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (single layer or multi-layer).
Table 6. Thermal Resistance JA for 24 Lead TSSOP, Forced Convection
JA vs. Air Flow
Meters per Second
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
87.8°C/W
83.5°C/W
81.3°C/W



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