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LX7167 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX7167
Description  3MHz, 2.4A Step Down Converter
PDF  12 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX7167 Datasheet(HTML) 2 Page - Microsemi Corporation

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3MHz 2.4A Synchronous Buck Converter
2
Pin Configuration and Pinout
PGND
SW
GND
FB
EN
PG
VCC
PVIN
1
2
3
4
5
6
7
8
Figure 2 · Pinout DFN 2mmx2mm 8L Top View
Marking: First Line 7167
Second Line YWWA (Year/Work Week/Lot Code)
Ordering Information
Pin Description
Pin
Number
Pin
Designator
Description
1
PGND
Ground pin for the power stage.
2
SW
Switch-node pin. Connect the output inductor between this pin and output capacitor.
When the chip is DISABLED, the internal discharge resistor will be enabled to discharge
the output capacitance. The current will flow into this pin.
3
GND
Ground pin.
4
FB
Voltage feedback pin. Connect to the output terminal through a resistor divider network
to set the output voltage of the regulator to the desired value.
5
EN
Pull this pin higher than 1V will enable the controller. When pulled low, the IC will turn
off and the Internal discharge FET will turn on to discharge the output capacitor through
the SW pin.
6
PG
Power-good pin. This is an open-drain output and should be connected to a voltage
rail with an external pull-up resistor. During the power on, this pin switches from
LOW to HI state when FB voltage reaches above the power good threshold and the
internal soft start has finished its operation. It will be pulled low when the FB falls
below the power-good threshold minus the hysteresis. It will turn back on when the
pull FB rises above the threshold.
7
VCC
Analog input voltage terminal. Connect this pin to VIN with a 10ohm resistor and
connect a 1µF ceramic capacitor from VCC to GND.
8
PVIN
Input voltage terminal of the regulator. A minimum of 10µF, X5R type ceramic
capacitor must be connected as close as possible from this pin to PGND plane to
insure proper operation.
Power PAD
For good thermal connection, this PAD must be connected using thermal VIAs to the
GND plane and to the LAND pattern of the IC.
Ambient Temperature
Type
Package
Part Number
Packaging Type
-10°C to 85°C
RoHS Compliant,
Pb-free
DFN 2mmx2mm 8L
LX7167CLD
Bulk / Tube
LX7167CLD-TR
Tape and Reel



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