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X0402MH Datasheet(PDF) 6 Page - STMicroelectronics |
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X0402MH Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 10 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 IPAK package information • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 • Lead-free package leads plating Figure 12. IPAK package outline X0402MH Package information DS14067 - Rev 1 page 6/10 |
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