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LX3045 Datasheet(PDF) 1 Page - Microsemi Corporation

Part # LX3045
Description  10.3 Gbps Coplanar GaAs PIN Photo Diode
PDF  5 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX3045 Datasheet(HTML) 1 Page - Microsemi Corporation

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LX3044 / 45 / 46
PRODUCTION DATA SHEET
Obsolete Product – Not Recommended For New Design
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
10.3 Gbps Coplanar GaAs PIN Photo Diode
I NT E GR A T ED
PRODUCT S
Copyright
© 2000
Rev. 1.1, 2005-09-14
DESCRIPTION
Microsemi’s GaAs Coplanar PIN
Photo Diode chips are ideal for high
bandwidth 850nm optical networking
applications.
The device family offers superior
noise performance and sensitivity in
single die, 1x4 array die or 1x12 array
die.
The LX304X family of photo diodes
are
currently
offered
in
die form
allowing manufacturers the versatility
of custom assembly using either bond
wire or flip chip configurations.
This
device
is
ideal
for
manufacturers
of
optical
receivers,
transponders,
optical
transmission
modules and combination PIN photo
diode – transimpedance amplifier.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATUR ES
LX3044 Single Die
LX3045, 1x4 Array Die
LX3046, 1x12 Array Die
Coplanar Waveguide , 50ohm
High Responsivity
Low Dark Current
High Bandwidth
Anode/Cathode on Illuminated
Side
125mm Pad pitch
Die Good for Bond Wire or Flip
Chip Applications
APPLI C ATION S
Short Reach Optical Networks
10Gigabit Ethernet, Fibre
Channel
VCSEL Array Receiver
BEN E FITS
Large Wirebond Contact Pads
Low Contact Resistance
PRODUCT H I GHLIGHT
Coplanar Design (gnd-signal-gnd) 50 ohm
characteristic impedance
125µm standard pad pitch for ease of test
Large 75µm x 75µm pad size for ease of
packaging
Wire bond or Flip Chip capability
Single Die
1x4 Die
1x12 Die
PACKAGE ORDER INFO
Die Dimension
1
(µm)
Pad Dimension
1
(µm)
TJ (°C)
Die
Die
Active Area, A
(µm)
Y
X
w
v
Pad Pitch, p
1
(µm)
Die Thickness
1
(µm)
LX3044
450
450
75
75
125
152
LX3045
450
1200
75
75
125
203
0 to 70
LX3046
75
450
3200
75
75
125
203
1. See Package Dimensions (page 4)
Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX3044-TR)


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