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ACTS240MS Datasheet(PDF) 3 Page - Renesas Technology Corp

Part # ACTS240MS
Description  High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State
PDF  3 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ACTS240MS Datasheet(HTML) 3 Page - Renesas Technology Corp

  ACTS240MS Datasheet HTML 1Page - Renesas Technology Corp ACTS240MS Datasheet HTML 2Page - Renesas Technology Corp ACTS240MS Datasheet HTML 3Page - Renesas Technology Corp  
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Rev X.00
Page 3 of 3
Jan 13, 2017
ACTS240MS
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
© Copyright Intersil Americas LLC 1999. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
Die Characteristics
DIE DIMENSIONS:
100 mils x 100 mils
2.54mm x 2.54mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125k
Å 1.125kÅ
Metal 2 Thickness: 9k
Å 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8k
Å 1kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
110
m x 110m
4.4 mils x 4.4 mils
Metallization Mask Layout
ACTS240MS
BO4 (3)
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
AI4 (8)
VCC
BO1 (9)
AO4 (12)
(13) BI2
(14) AO3
(15) BI3
(16) AO2
(17) BI4
(18) AO1
(20)
VCC
(20)
AEN
(1)
AI1
(2)
BEN
(19)
(11)
BI1
(10)
GND
(10)
GND



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