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VL53L8CXV0GC/1 Datasheet(PDF) 35 Page - STMicroelectronics |
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VL53L8CXV0GC/1 Datasheet(HTML) 35 Page - STMicroelectronics |
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35 / 42 page ![]() Figure 33. Solder profile Note: The component should be limited to a maximum of three passes through this solder profile. Note: As the VL53L8CX package is not sealed, only a dry reflow process should be used (such as convection reflow). Vapor phase reflow is not suitable for this type of optical component. Note: The VL53L8CX is an optical component and as such, it should be treated carefully. This typically includes using a ‘no-wash’ assembly process. 9.6 Handling and storage precautions 9.6.1 Recommended solder pad dimensions Figure 34. Recommended solder pattern VL53L8CX Handling and storage precautions DS14161 - Rev 2 page 35/42 |
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