Nexperia

BCV71

NPN general purpose transistors

13. Soldering

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

Fig. 2. Reflow soldering footprint for SOT23

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Fig. 3. Wave soldering footprint for SOT23

14. Revision history

Table 8. Revision history

Data sheet ID

Release date

Data sheet status

Change notice

Supersedes

BCV71 v.3

20220525

Product data sheet

-

BCV71 v.2

BCV71

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Product data sheet

25 May 2022

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