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CD4011BMS Datasheet(PDF) 9 Page - Renesas Technology Corp |
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CD4011BMS Datasheet(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() CD4011BMS, CD4012BMS, CD4023BMS FN3079 Rev 0.00 Page 9 of 9 November 1994 Chip Dimensions and Pad Layouts FIGURE 7. TYPICAL PROPAGATION DELAY TIME PER GATE AS A FUNCTION OF LOAD CAPACITANCE FIGURE 8. TYPICAL TRANSITION TIME AS A FUNCTION OF LOAD CAPACITANCE CD4011BMSH CD4012BMSH CD4023BMSH Typical Performance Characteristics (Continued) AMBIENT TEMPERATURE (TA) = +25oC 10V 15V SUPPLY VOLTAGE (VDD) = 5V LOAD CAPACITANCE (CL) (pF) 200 175 150 125 100 75 50 25 0 10 20 30 40 50 60 70 80 90 100 AMBIENT TEMPERATURE (TA) = +25oC LOAD CAPACITANCE (CL) (pF) 0 40 6080100 20 0 50 100 150 200 SUPPLY VOLTAGE (VDD) = 5V 10V 15V Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11k Å 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
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