HCS163MS

FN3087 Rev 1.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCS163MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS163 is TA14348A.

MR

CP

P0

P1

P2

P3

PE

GND

SPE

TE

Q3

Q2

Q1

Q0

TC

VCC