FN2803 Rev 4.00

Page 13 of 13

November 1999

HMU16, HMU17

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Plastic Leaded Chip Carrier Packages (PLCC)

NOTES:

1. Controlling dimension: INCH. Converted millimeter dimensions are

not necessarily exact.

2. Dimensions and tolerancing per ANSI Y14.5M-1982.

3. Dimensions D1 and E1 do not include mold protrusions. Allowable

mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1

and E1 include mold mismatch and are measured at the extreme

material condition at the body parting line.

4. To be measured at seating plane

contact point.

5. Centerline to be determined where center leads exit plastic body.

6. “N” is the number of terminal positions.

-C-

A1

A

SEATING

PLANE

0.020 (0.51)

MIN

VIEW “A”

D2/E2

0.025 (0.64)

0.045 (1.14)

R

0.042 (1.07)

0.056 (1.42)

0.050 (1.27) TP

E

E1

0.042 (1.07)

0.048 (1.22)

PIN (1) IDENTIFIER

CL

D1

D

0.020 (0.51) MAX

3 PLCS

0.026 (0.66)

0.032 (0.81)

0.045 (1.14)

MIN

0.013 (0.33)

0.021 (0.53)

0.025 (0.64)

MIN

VIEW “A” TYP.

0.004 (0.10)

C

-C-

D2/E2

CL

N68.95 (JEDEC MS-018AE ISSUE A)

68 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.165

0.180

4.20

4.57

-

A1

0.090

0.120

2.29

3.04

-

D

0.985

0.995

25.02

25.27

-

D1

0.950

0.958

24.13

24.33

3

D2

0.441

0.469

11.21

11.91

4, 5

E

0.985

0.995

25.02

25.27

-

E1

0.950

0.958

24.13

24.33

3

E2

0.441

0.469

11.21

11.91

4, 5

N68

68

6

Rev. 2 11/97