1999 Apr 22

7

Philips Semiconductors

Product specification

High-speed switching diode

BAS216

MOUNTING

Reflow soldering

Follow standard reflow soldering techniques to ensure

correct application of solder paste and placement of the

SOD110 package (see Fig.9).

Dimensions in mm.

Fig.9 SOD110 reflow soldering pattern.

handbook, halfpage

MGC119

,,

,,

,,,

,,,

3.00

1.25

1.00

1.00

,,

,,

,,,

,,,

Wave soldering

Before wave soldering, attach SOD110 packages to the

printed-circuit boards using a small dot of thermo-setting

epoxy or UV-curing adhesive centred between the

soldering lands (see Fig.10).

Dimensions in mm.

Fig.10 SOD110 wave soldering pattern.

handbook, halfpage

MGC126

,,

,,

3.40

1.25

1.10

,,

,,

,,,

,,,

1.10

,,,

,,,