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BAW56S Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BAW56S
Description  High-speed double diode array
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BAW56S Datasheet(HTML) 2 Page - NXP Semiconductors

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1997 Oct 21
2
Philips Semiconductors
Product specification
High-speed double diode array
BAW56S
FEATURES
• Small plastic SMD package
• High switching speed: max. 4 ns
• Continuous reverse voltage:
max. 75 V
• Repetitive peak reverse voltage:
max. 85 V
• Repetitive peak forward current:
max. 450 mA.
APPLICATIONS
• General purpose switching in e.g.
surface mounted circuits.
DESCRIPTION
The BAW56S consists of two dual
high-speed switching diodes with
common anodes, fabricated in planar
technology, and encapsulated in the
small SMD SOT363 plastic package.
PINNING
PIN
DESCRIPTION
1
cathode (k1)
2
cathode (k2)
3
common anode (a1)
4
cathode (k3)
5
cathode (k4)
6
common anode (a2)
handbook, halfpage
65
4
12
3 MGL159
Fig.1 Simplified outline (SOT363) and symbol.
Marking code: A1t.
MSA370
12
3
65
4
Top view
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. One or more diodes loaded.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per diode
VRRM
repetitive peak reverse voltage
−
85
V
VR
continuous reverse voltage
−
75
V
IF
continuous forward current
single diode loaded; see Fig.2
−
250
mA
all diodes loaded; see Fig.2
−
100
mA
IFRM
repetitive peak forward current
−
450
mA
IFSM
non-repetitive peak forward current
square wave; Tj =25 °C prior to
surge; see Fig.4
t=1
µs
−
4A
t=1ms
−
1A
t=1s
−
0.5
A
Ptot
total power dissipation
Ts =60 °C; note 1
−
350
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−65
+150
°C



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