TMUX8212 datasheet(3/42 Pages) TI

3 / 42 page

5 Device Comparison Table

PRODUCT

DESCRIPTION

TMUX8211

High Voltage, 4-channel, 1:1 (SPST) switches, (Logic Low)

TMUX8212

High Voltage, 4-channel, 1:1 (SPST) switches, (Logic High)

TMUX8213

High Voltage, 4-channel, 1:1 (SPST) switches, (Logic Low + Logic High)

6 Pin Configuration and Functions

SEL1

SEL2

GND

N.C.

SEL4

SEL3

Not to scale

Figure 6-1. PW Package, 16-Pin TSSOP (Top View)

SEL2

SEL1

SEL3

GND

N.C.

SEL4

Not to scale

Thermal

Pad

Figure 6-2. RUM Package, 16-Pin WQFN (Top View)

Table 6-1. Pin Functions

TYPE(1)

DESCRIPTION

NAME

TSSOP

WQFN

I/O

Drain pin 1. Can be an input or output.

I/O

Drain pin 2. Can be an input or output.

I/O

Drain pin 3. Can be an input or output.

I/O

Drain pin 4. Can be an input or output.

GND

Ground (0 V) reference

I/O

Source pin 1. Can be an input or output.

I/O

Source pin 2. Can be an input or output.

I/O

Source pin 3. Can be an input or output.

I/O

Source pin 3. Can be an input or output.

I/O

Source pin 4. Can be an input or output.

SEL1

Logic control input 1.

SEL2

Logic control input 2.

SEL3

Logic control input 3.

SEL4

Logic control input 4.

N.C.

—

No internal connection.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation,

connect a decoupling capacitor ranging from 1 µF to 10 µF between VDD and GND.

VSS

Negative power supply. This pin is the most negative power-supply potential. In single-supply

applications, this pin can be connected to ground. For reliable operation, connect a decoupling

capacitor ranging from 1 µF to 10 µF between VSS and GND.

Thermal Pad

—

The thermal pad is not connected internally. It is recommended that the pad be tied to GND or VSS

for best performance.

(1)

I = input, O = output, I/O = input and output, P = power

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TMUX8211, TMUX8212, TMUX8213

SCDS434B – OCTOBER 2021 – REVISED MARCH 2023

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