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ISL70023SEHL/PROTO Datasheet(PDF) 9 Page - Renesas Technology Corp |
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ISL70023SEHL/PROTO Datasheet(HTML) 9 Page - Renesas Technology Corp |
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9 / 13 page ![]() FN8975 Rev.4.01 Page 9 of 12 May 4, 2022 ISL70023SEH, ISL73023SEH 4. Die Characteristics 4. Die Characteristics Table 2. Die and Assembly Related Information Die Information Dimensions 6050µm x 2300µm (238.19 mils x 90.55 mils) Thickness: 685µm (26.97 mils) ISL70023SEH, ISL73023SEH Table 3. Dimensions Dimension Min (µm) Nominal (µm) Max (µm) A 6020 6050 6080 B 2270 2300 2330 c 2047 2050 2053 d 717 720 723 e 210 225 240 f 195 200 205 g 400 400 400 4 2 6 8 101214 16 18 20 22 24 26 28 30 3 1 5 7 9 11 13 15 17 19 21 23 25 27 29 e g c d f A B 685µm 785µm 100µm ±20µm Pads in Green are the Source Pads in Orange are the Drain Pad in Blue is the Gate Pad in Purple is the Substrate Color Key: Solder Bump View Side View |
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