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PCFF30H120SWF Datasheet(PDF) 1 Page - ON Semiconductor |
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PCFF30H120SWF Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 4 page ![]() DIE DATA SHEET www.onsemi.com © Semiconductor Components Industries, LLC, 2023 April, 2023 − Rev. 0 1 Publication Order Number: PCFF30H120SWF−DIE/D Diode – Power, Bare Die Gen VII, Fast Recovery 1200 V, 30 A PCFF30H120SWF Features • Advanced Gen VII Technology • Fast and Soft Recovery • Maximum Junction Temperature 175°C • Low Forward Voltage: VF = 1.78 V (Typ.) @ IF = 30 A • Easy to Parallel Operation Typical Applications • Solar • Energy Storage • Industrial Motor Control MECHANICAL PARAMETERS Parameter Value Unit Die Size (w/ Scribe Lane) 2,970 x 4,500 mm2 Anode Pad Size 1,987 x 3,517 mm2 Scribe Lane Width 80 mm Die Thickness 119 mm Top Metal 6 mm AlSiCu Back Metal 1.65 mm Ti/NiV/Ag Topside Passivation Silicon Nitride plus Polyimide Wafer Diameter 200 mm Max Possible Die Per Wafer 1886 Recommended Storage Environment In original container, in dry nitrogen, < 6 months at an ambient temperature of 23°C Device Inking Shipping ORDERING INFORMATION PCFF30H120SWF Yes Sawn Wafer on Tape DIE OUTLINE VR = 1200 V IF = 30 A DIODE DIE C A |
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