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BAS16J Datasheet(PDF) 2 Page - Nexperia B.V. All rights reserved |
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BAS16J Datasheet(HTML) 2 Page - Nexperia B.V. All rights reserved |
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2 / 8 page ![]() Nexperia BAS16J High-speed switching diode 6. Ordering information Table 3. Ordering information Package Type number Name Description Version BAS16J SC-90 plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body SOD323F 7. Marking Table 4. Marking codes Type number Marking code BAS16J AR 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VRRM repetitive peak reverse voltage - 100 V VR reverse voltage - 100 V IF forward current [1] - 250 mA tp = 1 µs; square wave; Tj(init) = 25 °C - 4 A tp = 1 ms; square wave; Tj(init) = 25 °C - 1 A IFSM non-repetitive peak forward current tp = 1 s; square wave; Tj(init) = 25 °C - 0.5 A IFRM repetitive peak forward current tp ≤ 0.5 ms; δ ≤ 0.25 - 500 mA Ptot total power dissipation Tamb ≤ 25 °C [2] - 550 mW Per device Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm². 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 230 K/W Rth(j-sp) thermal resistance from junction to solder point [2] - - 55 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm². [2] Soldering point of cathode tab. BAS16J All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. All rights reserved Product data sheet 1 October 2022 2 / 8 |
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