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MMA6281QR2 Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MMA6281QR2 Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 11 page ![]() Sensors Freescale Semiconductor 7 MMA6281QT MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. The flag underneath the package is internally connected to ground. It is not recommended for the flag to be soldered down. Solder areas Pin 1 ID (non metallic) 9 12 4.25 6.0 14 1.00 0.55 Flag Non-Solder areas |
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