Nexperia

BAW101S

High voltage double diode

12. Soldering

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35

0.4 (2×)

0.6

(2×)

0.5

(4×)

0.5

(4×)

0.6

(4×)

0.6

(4×)

1.5

1.8

Dimensions in mm

Fig. 8. Reflow soldering footprint for TSSOP6 (SOT363)

sot363_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

5.3

1.3

1.3

1.5

0.3

1.5

4.5

2.45

2.5

Dimensions in mm

Fig. 9. Wave soldering footprint for TSSOP6 (SOT363)

BAW101S

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Product data sheet

1 October 2022

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