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TPCF8B01 Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TPCF8B01 Datasheet(HTML) 1 Page - Toshiba Semiconductor |
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1 / 4 page ![]() TPCF8B01 2003-04-08 1 TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode TPCF8B01 Notebook PC Applications Portable Equipment Applications • Low drain-source ON resistance: RDS (ON) = 72 mÙ (typ.) • High forward transfer admittance: |Yfs| = 4.7 S (typ.) • Low leakage current: IDSS = −10 ìA (max) (VDS = −20 V) • Enhancement-model: Vth = −0.5 to −1.2 V(VDS =−10 V, ID = −200 ìA) • Low forward voltage: VFM = 0.46V(typ.) Maximum Ratings MOSFET (Ta = 25°C) Characteristics Symbol Rating Unit Drain-source voltage VDSS −20 V Drain-gate voltage (RGS = 20 kΩ) VDGR −20 V Gate-source voltage VGSS ±8 V DC (Note 1) ID −2.7 Drain current Pulse (Note 1) IDP −10.8 A Single pulse avalanche energy (Note 4) EAS 1.2 mJ Avalanche current IAR −1.35 A Repetitive avalanche energy Single-device value at dual operation (Note 2a, 3b, 5) EAR 0.11 mJ SBD (Ta = 25°C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 20 V Average forward current (Note 2a, 6) IF(AV) 1.0 A Peak one cycle surge forward current (non-repetitive) IFSM 7(50Hz) A Maximum Ratings for MOSFET and SBD (Ta = 25°C) Characteristics Symbol Rating Unit Single-device operation (Note 3a) PD (1) 1.35 Drain power dissipation (t = 5 s) (Note 2a) Single-device value at dual operation (Note 3b) PD (2) 1.12 Single-device operation (Note 3a) PD (1) 0.53 Drain power dissipation (t = 5 s) (Note 2b) Single-device value at dual operation (Note 3b) PD (2) 0.33 W Channel temperature Tch 150 °C Storage temperature range Tstg −55~150 °C Note: For (Note 1), (Note 2), (Note 3), (Note 4), (Note 5), (Note 6) and (Note 7), please refer to the next page. Unit: mm JEDEC JEITA TOSHIBA Weight: 0.011 g (typ.) Circuit Configuration Marking (Note 7) 8 1 5 4 F8A 1. Anode 5. Drain 2. Anode 6. Drain 3.Source 7. Cathode 4. Gate 8. Cathode 1 2 3 4 8 7 6 5 |
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