MCF548x Integrated Microprocessor Electrical Characteristics, Rev. 2.4

Thermal Characteristics

Freescale Semiconductor

2

2

Thermal Characteristics

2.1

Operating Temperatures

Table 2 lists junction and ambient operating temperatures.

2.2

Thermal Resistance

Table 3 lists thermal resistance values.

Table 1. Absolute Maximum Ratings

Rating

Symbol

Value

Units

External (I/O pads) supply voltage (3.3-V power pins)

–0.3 to +4.0

V

Internal logic supply voltage

–0.5 to +2.0

V

Memory (I/O pads) supply voltage (2.5-V power pins)

–0.3 to +4.0 SDR Memory

–0.3 to +2.8 DDR Memory

V

PLL supply voltage

–0.5 to +2.0

V

Internal logic supply voltage, input voltage level

–0.5 to +3.6

V

Storage temperature range

–55 to +150

Table 2. Operating Temperatures

Characteristic

Symbol

Value

Units

Maximum operating junction temperature

105

Maximum operating ambient temperature

NOTES:

1

This published maximum operating ambient temperature should be used only as a system design guideline. All

device operating parameters are guaranteed only when the junction temperature lies within the specified range.

Minimum operating ambient temperature

– 40

Table 3. Thermal Resistance

Characteristic

Symbol

Value

Unit

324 pin TEPBGA — Junction to ambient, natural

convection

Four layer board (2s2p)

θ

JMA

°C/W

388 pin TEPBGA — Junction to ambient, natural

convection

Four layer board (2s2p)

θ

JMA

20–221,2

°C/W

Junction to ambient (@200 ft/min)

Four layer board (2s2p)

θ

JMA

231,2

°C/W

Junction to board

θ

JB

°C/W

Junction to case

θ

JC

°C/W

Junction to top of package

Natural convection

Ψ

jt

21,5

°C/W