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BFQ17 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BFQ17 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 6 page ![]() September 1995 3 Philips Semiconductors Product specification NPN 1 GHz wideband transistor BFQ17 THERMAL RESISTANCE Note 1. Ts is the temperature at the soldering point of the collector tab. CHARACTERISTICS Tj = 25 °C unless otherwise specified. Note 1. GUM is the maximum unilateral power gain, assuming S12 is zero and SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE Rth j-s thermal resistance from junction to soldering point up to Ts = 145 °C (note 1) 30 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = 20 V; Tj =50 °C −− 20 µA VCE sat collector-emitter saturation voltage IC = 100 mA; IB = 10 mA −− 0.5 V hFE DC current gain IC = 150 mA; VCE = 5 V 25 80 − Cc collector capacitance IE = ie = 0; VCB = 15 V; f = 1 MHz −− 4pF Cre feedback capacitance IC = 10 mA; VCE = 15 V; f = 1 MHz; Tamb = 25 °C − 1.9 − pF fT transition frequency IC = 150 mA; VCE = 15 V; f = 500 MHz − 1.5 − GHz GUM maximum unilateral power gain (note 1) IC = 60 mA; VCE = 15 V; f = 200 MHz; Tamb = 25 °C − 16 − dB IC = 60 mA; VCE = 15 V; f = 800 MHz; Tamb = 25 °C − 6.5 − dB G UM 10 S 21 2 1S 11 2 – 1S 22 2 – -------------------------------------------------------------- dB. log = |
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