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BLF276 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BLF276 Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 13 page ![]() December 1997 4 Philips Semiconductors Product specification VHF power MOS transistor BLF276 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID = 30 mA 110 −− V IDSS drain-source leakage current VGS = 0; VDS = 50 V −− 1mA IGSS gate-source leakage current ±VGS = 20 V; VDS = 0 −− 1 µA VGS(th) gate-source threshold voltage ID = 50 mA; VDS = 10 V 2 − 4.5 V gfs forward transconductance ID = 3 A; VDS = 10 V 2.7 −− S RDS(on) drain-source on-state resistance ID = 3 A; VGS = 10 V − 0.4 0.6 Ω IDSX on-state drain current VGS = 10 V; VDS = 10 V 8 12 − A Cis input capacitance VGS = 0; VDS = 50 V; f = 1 MHz − 240 − pF Cos output capacitance VGS = 0; VDS = 50 V; f = 1 MHz − 95 − pF Crs feedback capacitance VGS = 0; VDS = 50 V; f = 1 MHz − 7 − pF Fig.4 Temperature coefficient of gate-source voltage as a function of drain current, typical values. VDS = 10 V. handbook, halfpage 0 −1 −2 −3 −4 −5 10−1 10 10−2 1 ID (A) TC (mV/K) MRA945 Fig.5 Drain current as a function of gate-source voltage, typical values. VDS = 10 V. handbook, halfpage 0 4 8 12 16 02 46 8 ID (A) 10 VGS (V) 12 14 MRA940 |
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