August 4, 2006 S30MS-P_00_A7

11

Da ta

Shee t

(Prelim i nar y )

7.

Ordering Information

The order number is formed by a valid combinations of the following:

7.1

Valid Combinations

Valid Combination list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Notes:

1. Type 0 is standard. Specify other options as required.

2. See the MCP ORNAND data sheet for further package details.

3. Model Numbers 50 and 51 must use 2-bit detection, 1-bit correction for applications that require 100% error-free read performance.

4. Model Numbers 50 and 51 may have up to 2% invalid blocks.

5. Model Numbers 50 and 51 have a boot block (Block 0 is valid upon shipment and error-free through 1000 cycles).

S30MS

01G

P

25

B

F

W

00

2

Packing Type

0= Tray

2

= 7-inch Tape and Reel

3

= 13-inch Tape and Reel

Model Number (3) (4)

00 = x8; ECC-Free

01 = x16; ECC-Free

50 = x8; ECC-Required with Boot Block

51 = x16; ECC-Required with Boot Block

Temperature Range

W = Wireless (–25°C to +85°C)

Package Material Set

A = Standard

F

= Pb-Free

Package Type

T

= Thin Small Outline Package

B = Ball-Grid Array Package

Speed Option Serial Read Access Time

25 = 25 ns

Process Technology

P = 90 nm MirrorBit™ Technology

Flash Density

01G= 1Gb

512= 512Mb

Product Family

S30MS = 1.8 volt -only, NAND Interface Flash Memory

Valid Combinations

Base Ordering

Part Number

Speed

Option

Package Type, Material,

and Temperature Range

Model

Number

Packing

Type

Package

Type

S30MS01GP

S30MS512P

25

BAW, BFW

00, 01,

50, 51

0, 3

(Note 1)

137-Ball FBGA

TAW, TFW

TSOP-48