1997 Nov 10

8

Philips Semiconductors

Preliminary specification

UHF push-pull power transistor

BLV897

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT324B

97-06-05

0

5

10 mm

scale

Flanged ceramic package; 2 mounting holes; 4 leads

SOT324B

0.13

0.07

1.66

1.39

8.69

8.07

1.66

1.39

5.59

4.57

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

3.43

3.17

4.37

3.55

2.32

2.00

D

q

U1

2

5

4

1

3

A

U2

E

p

b

s

L

L

Q

F

c

UNIT

Q

cD

6.91

6.29

EF

L

p

q

mm

b

19.03

18.77

U2

U1

1.66

1.39

s

6.43

6.17

0.51

14.22

w1

1.02

w2

A

M

C

C

A

w1

w2

AB

M

B