Use

Material

Cd

CrVl

Pb

Hg

PBB

PBDE

Ref #

Device

CHIP

<10

<10

<10

<10

<10

<10

1000

COMPOUND

<2

<10

<5

<1

<100

<100

569

EPOXY

<2

<10

<5

<1

<100

<100

32

EXTLF

<2

<10

154000

<1

N/A

N/A

56

FRAME

< 2

< 2

< 2

< 2

N/A

N/A

51

WIRE

<2

<2

<2

<2

N/A

N/A

75

Packing

BAG

<2

<10

<5

<1

N/A

N/A

550

BOX

<2

<2

5

<2

N/A

N/A

539

BUBBLE PACK

<2

<10

<5

<1

N/A

N/A

542

DESICCANT

<5

<5

<10

<1

NA

NA

108

INDICATOR

<5

<5

<10

<1

NA

NA

120

LABEL

<5

<5

<10

<1

NA

NA

48

REEL

<2

<2

<2

<2

N/A

N/A

525

STRIP

ND

ND

ND

ND

NA

NA

540

TAPE

<2

<10

<5

<1

N/A

N/A

123

Ref #

1000

Analysis on 04/25/2005 by Balazs Analytical Services-Freemont CA per Report# 05-02036-00

32

Analysis on 04/18/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2026BS/2006

48

Analysis on 05/30/2005 by PSB-Singapore per Report# 57S051137-048A-PPG

51

Analysis on 03/30/2006 by SGS-Port Klang-Malaysia per Report# LPCI/05021/06

56

Analysis on 04/20/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2047BS/2006

75

Analysis on 04/21/2006 by SGS-Port Klang-Malaysia per Report# LPCI/06487/06

108

Analysis on 05/30/2005 by PSB-Singapore per Report# 57S051137-108-PPG

120

Analysis on 05/30/2005 by PSB-Singapore per Report# 57S051137-120-PPG

123

Analysis on 04/18/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATBJ/2042BS/2006

525

Analysis on 03/30/2006 by SGS-Port Klang-Malaysia per Report# LPCI/05045/06

539

Analysis on 03/30/2006 by SGS-Port Klang-Malaysia per Report# LPCI/05059/06

540

Analysis on 03/18/2005 by SGS-Malacca per Report# LPCI/1296/05

542

Analysis on 04/18/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2038BS/2006

550

Analysis on 04/18/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2032BS/2006

569

Analysis on 04/18/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2009BS/2006

RoHS Directive

2002/95/EC

Gerry Fields

Vice President Quality

This part number contains Lead(Pb) and is NOT RoHS Compliant.

RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent

Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100

PPM) of homogeneous material for Cadmium

Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.

1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances

2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above

Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.

2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These

products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold

levels, except lead in solder and RoHS exempt applications 5, 7a and 7c.

3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements

for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at

www.national.com/quality/green/.

4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances

that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.

RoHS Material Composition Declaration

Banned Substance Monitoring

* Unless otherwise noted, units are in PPM (parts-per-million)

* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected

3rd Party Analysis (available upon request, subject to a non-disclosure agreement)

Document Date

3-Dec-2006

Part Number

LM4863MX

National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified

information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided herein is

derived from default values associated with internal monitoring process and may not be representative of all or actual materials used in the product

(e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used).

Certain National suppliers consider material content information to be confidential and thus CAS numbers for such materials may not be available

for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any

issues arising out of or in connection with the statements or information provided herein.

National Semiconductor

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