PACKAGE AVAILABILITY

No. of Pins

Frame Size

Thin and Low Profile QFP Packages (0.4, 0.5 mm lead pitch)

100

K1, K2

120

K2, K3

144

K3, K4, K8, T2, T3

176

K4, K5, T3, T4

208

T4, T5, T6, T7, T8, T9

256

T8, T9, TA, TB, TC

Shrink QFP Package (0.5 mm lead pitch)

176

J1, J2, K4, K5

208

J3, J4, J5, K5, K6, K7, K8

240

J4, J5, J6, K6, K7, K8

Heatspreader QFP Package (0.4, 0.5 mm lead pitch)

208

J3, J4, J5, J6, J7, J8, J9, K5, K6, K7, K8

T4, T5, T6, T7, T8, T9

240

J4, J5, J6, J7, J8, J9, JA, K6, K7, K8, T6, T7, T8, T9, TA

256

J5, J6, J7, J8, J9, T7, T8, T9, TA, TB, TC

304

J7, J8, J9, JA, JB, JC, JD, JE, JF, JG, TB, TC, TD, TE, TG

Ball Grid Array (1.27 mm ball pitch)

256

J3, J4, T7, T8, T9, TA, TB

352

J6, J7, J8, TB, TC, TD

420

J8, J9, TD, TE

576

JA, JB

672

JC, JD

Fine-Pitch Ball Grid Array (0.75, 0.8 mm ball pitch)

144

T3

176

T3, T4

224

T5, T6, T7, T8, T9

288

T8, T9, TA, TB, TC

Tab Ball Grid Array (0.8, 1.0 mm ball pitch)

304

L4, L5

352

L5, L6, L7

480

L6, L7

560

L7, L8, LB, LC

660

L8, L9

720

L9, LA, LB, LC, LD, LE

0.25µm CMOS Technology

Fujitsu Microelectronics, Inc.