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BLV950 Datasheet(PDF) 4 Page - NXP Semiconductors

Part # BLV950
Description  UHF push-pull power transistor
PDF  16 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BLV950 Datasheet(HTML) 4 Page - NXP Semiconductors

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1997 Oct 27
4
Philips Semiconductors
Product specification
UHF push-pull power transistor
BLV950
CHARACTERISTICS
Tj =25 °C unless otherwise specified.
Notes
1. Measured under pulse conditions: tp ≤ 300 µs; δ≤ 0.01.
2. Value Cc is that of the die only, it is not measurable because of internal matching network.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Per transistor section
V(BR)CBO
collector-base breakdown voltage
open emitter; IC =60mA
70
−−
V
V(BR)CEO
collector-emitter breakdown voltage
open base; IC = 150 mA
30
−−
V
V(BR)EBO
emitter-base breakdown voltage
open collector; IE = 3 mA
3
−−
V
ICES
collector leakage current
VBE = 0; VCE =28V
−−
5mA
hFE
DC current gain
VCE = 10 V; IC = 4.5 A; note 1
30
−
120
Cc
collector capacitance
VCB = 26 V; IE =ie =0;
f = 1 MHz; note 2
−
75
−
pF
Fig.2
DC current gain as a function of collector
current; typical values.
Measured under pulsed conditions; tp ≤ 300 µs; δ≤ 0.01.
(1) VCE =26V.
(2) VCE =10V.
handbook, halfpage
0
40
60
20
80
04
8
12
16
hFE
I C (A)
MLD256
(2)
(1)
Fig.3
Collector capacitance as a function of
collector-base voltage; typical values.
handbook, halfpage
0
200
100
300
010
20
30
50
40
Cc
V
(V)
CB
MLD257
(pF)
Value Cc is that of the die only, it is not measurable because of
internal matching network.
IE =ie = 0; f = 1 MHz.



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