Data Sheet G15368EJ4V0DS

12

μPC29M33A, 29M05A

RECOMMENDED SOLDERING CONDITIONS

The

μ PC29M33A, 29M05A should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Surface Mount Device

μ PC29MxxAT Series: SC-63 (MP-3Z)

Process

Conditions

Symbol

Infrared Ray Reflow

Peak temperature: 235

°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 3 times or less.

IR35-00-3

Vapor Phase Soldering

Peak temperature: 215

°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 3 times or less.

VP15-00-3

Partial Heating Method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (Per each side of the device).

P350

μ PC29MxxAT-AZ Series

Note1, μPC29MxxAT-AY Series Note2: SC-63 (MP-3Z)

Process

Conditions

Symbol

Infrared Ray Reflow

Peak temperature: 260

°C or below (Package surface temperature),

Reflow time: 60 seconds or less (at 220

°C or higher),

Maximum number of reflow processes: 3 times or less.

IR60-00-3

Partial Heating Method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (Per each side of the device).

P350

Notes 1. Pb-free (This product does not contain Pb in the external electrode.)

2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.

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