 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA

SCD5580/1/2/3/4 A

www.infineon.com/opto • 1-888-Infineon (1-888-463-4636)

OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany

www.osram-os.com • +49-941-202-7178

9

March 23, 2000-18

Figure 10. Row Strobing

Multiplexer and Display Driver

The eight characters are row multiplexed with RAM resident

column data. The strobe rate is established by the internal or

external MUX Clock rate. The MUX Clock frequency is divided

by a 320 counter chain. This results in a typical strobe rate of

750 Hz. By pulling the Clock SEL line low, the display can be

operated from an external MUX Clock. The external clock is

attached to the CLK I/O connection (pin 15). The maximum

external MUX Clock frequency should be limited to 1.0 MHz.

An asynchronous hardware Reset (pin 13) is also provided.

Bringing this pin low will clear the Character Address Register,

Control Word Register, RAM, and blanks the display. This

action leaves the display set at Character Address 0, and the

Brightness Level set at 100%.

Thermal Considerations

The SCD558XA has been designed to provide lowest thermal

resistance from the CMOS to the ground pin.

The heat is then conducted through the traces on the users cir-

cuit board to free air. The max. IC operating temperature is

125

°C. Maximum. IC junction temperature is calculated using

the following equation:

where R

θ

=5.5 Vx0.240=1.32 W.

R

θ

are soldered to the pcb or socketed and on air circulation.

Electrical & Mechanical Considerations

Interconnect Considerations

Optimum product performance can be had when the following

electrical and mechanical recommendations are adopted. The

SCD558XA’s ICs are constructed in a high speed CMOS pro-

cess, consequently high speed noise on the SERIAL DATA,

SERIAL DATA CLOCK, LOAD and RESET lines may cause

incorrect data to be written into the serial shift register. Adhere

to transmission line termination procedures when using fast

line drivers and long cables (>10 cm).

Good digital grounds (pins 14, 28) and power supply decoupling

currents do not generate localized ground bounce. Therefore it

is recommended that each display package use a 0.1

µF and

20

µF capacitor between V

When the internal MUX Clock is being used, connect the

Row 0

Row 1

Row 2

Row 3

Row 4

0 1 2 3 4

Columns

Row 0

Row 1

Row 2

Row 3

Row 4

0 1 2 3 4

Columns

Row 0

Row 1

Row 2

Row 3

Row 4

0 1 2 3 4

Columns

Row 0

Row 1

Row 2

Row 3

Row 4

0 1 2 3 4

Columns

Row 0

Row 1

Row 2

Row 3

Row 4

0 1 2 3 4

Columns

ROW LOAD

LOAD ROW 0

LOAD ROW 1

LOAD ROW 2

LOAD ROW 3

LOAD ROW 4

tions where RESET will not be connected to the system’s reset

control, it is recommended that this pin be connected to the

center node of a series 0.1,

µF and 100 kΩ RC network. Thus

upon initial power up the RESET will be held low for 10 ms

allowing adequate time for the system power supply to stabilize.

ESD Protection

The input protection structure of the SCD558XA provides sig-

nificant protection against ESD damage. It is capable of with-

standing discharges greater than 2.0 kV. Take all the standard

precautions, normal for CMOS components. These include

properly grounding personnel, tools, tables, and transport carri-

ers that come in contact with unshielded parts. If these condi-

tions are not, or cannot be met, keep the leads of the device

shorted together or the parts in anti-static packaging.

Soldering Considerations

The SCD558XA can be hand soldered with SN63 solder using a

grounded iron set to 260

°C.

Wave soldering is also possible following these conditions: Pre-

heat that does not exceed 93

°C on the solder side of the PC

board or a package surface temperature of 85

°C. Water soluble

organic acid flux (except carboxylic acid) or rosin-based RMA

flux without alcohol can be used.

Wave temperature of 245

°C ±5°C with a dwell between 1.5 sec.

to 3.0 sec. Exposure to the wave should not exceed tempera-

tures above 260

°C for five seconds at 0.063" below the seating

plane. The packages should not be immersed in the wave.

Post Solder Cleaning Procedures

The least offensive cleaning solution is hot D.I. water (60

°C) for

less than 15 minutes. Addition of mild saponifiers is acceptable.

Do not use commercial dishwasher detergents.

For faster cleaning, solvents may be used. Exercise care in

choosing solvents as some may chemically attack the nylon

package. Maximum exposure should not exceed two minutes at

elevated temperatures. Acceptable solvents are TF (trichlorotrif-

Note:

D. Genesolv DA, Blaco-Tron TF, Blaco-Tron TA, and Freon TA.

Unacceptable solvents contain alcohol, methanol, methylene

chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since

many commercial mixtures exist, contact a solvent vendor for

chemical composition information. Some major solvent manu-

facturers are: Allied Chemical Corporation, Specialty Chemical