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MCP6071 Datasheet(PDF) 12 Page - Microchip Technology

Part # MCP6071
Description  110 μA, High Precision Op Amps
PDF  42 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP6071 Datasheet(HTML) 12 Page - Microchip Technology

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MCP6071/2/4
DS20002142C-page 12
 2009-2021 Microchip Technology Inc. and its subsidiaries
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The noninverting and inverting inputs are high-
impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6071
MCP6072
MCP6074
Symbol
Description
SOIC
SOT-23-5 2x3 TDFN
SOIC
2x3 TDFN
SOIC,
TSSOP
61
6
1
1
1
VOUT, VOUTA Analog Output (op amp A)
24
2
2
2
2
VIN–, VINA– Inverting Input (op amp A)
33
3
3
3
3
VIN+, VINA+ Noninverting Input (op amp A)
75
7
8
8
4
VDD
Positive Power Supply
——
—
5
5
5
VINB+
Noninverting Input (op amp B)
——
—
6
6
6
VINB–
Inverting Input (op amp B)
——
—
7
7
7
VOUTB
Analog Output (op amp B)
——
—
—
—
8
VOUTC
Analog Output (op amp C)
——
—
—
—
9
VINC–
Inverting Input (op amp C)
——
—
—
—
10
VINC+
Noninverting Input (op amp C)
42
4
4
4
11
VSS
Negative Power Supply
——
—
—
—
12
VIND+
Noninverting Input (op amp D)
——
—
—
—
13
VIND–
Inverting Input (op amp D)
——
—
—
—
14
VOUTD
Analog Output (op amp D)
1, 5, 8
—
1, 5, 8
—
—
—
NC
No Internal Connection
—
—
9
—
9
—
EP
Exposed Thermal Pad (EP); must
be connected to VSS.



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