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5307S Series
Page 31
Single Color φ5 Flush Mount Round Shape Type
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
TTW (Through The Wave) soldering Conditions
Solder Bath Temp.
Dipping Time
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to room temp. before the second dipping process.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
265℃
5 s
Pre-heating
100 ℃
(MAX.)
(MAX.)
(MAX.)
3 s
2 times
400℃
(MAX.)
(MAX.)
(MAX.)
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
2006.3.31