UPD78P018F datasheet(14/78 Pages) RENESAS

14 / 78 page

µPD78P018F

CONTENTS

DIFFERENCES BETWEEN

µPD78P018F AND MASK ROM VERSIONS ................................... 13

PIN FUNCTIONS .............................................................................................................................. 14

2.1

Pins During Normal Operating Mode ................................................................................................... 14

2.2

Pins During PROM Programming Mode .............................................................................................. 16

2.3

Pin I/O Circuits and Recommended Connection of Unused Pins ................................................... 17

INTERNAL MEMORY SIZE SWITCHING REGISTER (IMS) ......................................................... 19

INTERNAL EXPANSION RAM SIZE SWITCHING REGISTER (IXS) ........................................... 20

PROM PROGRAMMING .................................................................................................................. 21

5.1

Operating Modes ..................................................................................................................................... 21

5.2

PROM Write Procedure .......................................................................................................................... 23

5.3

PROM Read Procedure .......................................................................................................................... 27

PROGRAM ERASURE (FOR

µPD78P018FDW, 78P018FKK-S) .................................................. 28

OPAQUE FILM ON ERASURE WINDOW (FOR

µPD78P018FDW, 78P018FKK-S) ................... 28

ONE-TIME PROM VERSION SCREENING .................................................................................... 28

ELECTRICAL SPECIFICATIONS .................................................................................................... 29

10. CHARACTERISTIC CURVE (REFERENCE VALUE) .................................................................... 58

11. PACKAGE DRAWINGS ................................................................................................................... 59

12. RECOMMENDED SOLDERING CONDITIONS .............................................................................. 64

APPENDIX A. DEVELOPMENT TOOLS .............................................................................................. 65

APPENDIX B. RELATED DOCUMENTS .............................................................................................. 71

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