The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

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SOLDER ABILITY

Item

Requirement

Test Condition

Solderability

The surface of the portion to be

soldered shall at least 95% covered

with new solder coating.

After 1 hour steam aging.

The object of test procedure is to

detail a unfirm test methods for

determining sim card connector

solderability. The test procedure

contained here utilizes the solder dip

technique. It is not intended to test

or evaluate solder cup, solder eyelet,

other hand-soldered type or SMT

type terminations.

Resistance to Soldering

Heat

No mechanical defect on housing or

other parts

1).For Wave Soldering

Pre-Heat:80°C, 60 sec.

Temperature:260±5°C

Immersion duration:3±0.5sec.

(MIL-STD-202F, Method 210A, Test

Condition B)

2).For Manual Soldering

Pre-Heat:No.

Temperature:380±10°C

Immersion duration:3±0.5sec.

(MIL-STD-202F, Method 210A, Test

Condition A)

3).For Reflow Soldering

Pre-Heat:150(Min.)~200(Max.)°C,

60~180sec.

Temperature:260±5°C

Immersion duration:10~40 sec.

(EIAJ RCX-0101/102)