FSB50760BSF / FSB50760BSFS

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2

PACKAGE MARKING AND ORDERING INFORMATION

Device Marking

Device

Package

Reel Size

Packing Type

Quantity

50760BSF

FSB50760BSF

SPM5P−023

Rail

NA

15

50760BSFS

FSB50760BSFS

SPM5Q−023

Tape & Reel

330 mm

450

ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise noted)

Symbol

Parameter

Conditions

Rating

Unit

INVERTER PART (Each MOSFET Unless Otherwise Specified)

VPN

DC Link Input Voltage,

Drain−Source Voltage of Each MOSFET

600

V

BVDSS

Drain−Source Voltage

VIN = 0V, ID = 250 mA

600

V

IPN

Zero−Bias Static Leakage Current

VPN = 400 V, VIN = 0 V,

VDD = VBS = 0 V,

TC = TJ = 25°C for all phase

40

mA

*ID 25

Each MOSFET Drain Current, Continuous

TC = 25°C

3.6

A

*ID 80

Each MOSFET Drain Current, Continuous

TC = 80°C

2.7

A

*IDP

Each MOSFET Drain Current, Peak

TC = 25°C, PW < 100 ms

9.4

A

*IDRMS

Each FRFET Drain Current, Rms

TC = 80°C, FPWM < 20 kHz

1.9

Arms

*PD

Maximum Power Dissipation

TC = 25°C, For Each MOSFET

14.5

W

CONTROL PART (Each HVIC Unless Otherwise Specified)

VDD

Control Supply Voltage

Applied Between VDD and COM

20

V

VBS

High−side Bias Voltage

Applied Between VB and VS

20

V

VIN

Input Signal Voltage

Applied Between IN and COM

−0.3 ~ VDD+0.3

V

BOOTSTRAP DIODE PART (Each Bootstrap Diode Unless Otherwise Specified.)

VRRMB

Maximum Repetitive Reverse Voltage

600

V

* IFB

Forward Current

TC = 25°C

0.5

A

* IFPB

Forward Current (Peak)

TC = 25°C, Under 1ms Pulse Width

1.5

A

THERMAL RESISTANCE

Rth(j−c)Q

Junction to Case Thermal Resistance

(Note 1)

Inverter MOSFET part, (Per Module)

2.15

°C/W

TOTAL SYSTEM

TJ

Operating Junction Temperature

−40 ~ 150

°C

TSTG

Storage Temperature

−40 ~ 125

°C

VISO

Isolation Voltage

60 Hz, Sinusoidal, 1 minute,

Connection Pins to Heatsink

1500

Vrms

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. For the Measurement Point of Case Temperature TC, Please refer to Figure 4.

2. Marking “ * ” Is Calculation Value or Design Factor.

3. Using contiunously under heavy loads or excessive assembly conditions (e.g. the application of high temperature/ current/ voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions

(i.e. operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings and the operating ranges.