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M24C64-FMB6/B Datasheet(PDF) 31 Page - STMicroelectronics |
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M24C64-FMB6/B Datasheet(HTML) 31 Page - STMicroelectronics |
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31 / 34 page ![]() M24128, M24C64, M24C32 Part numbering 31/34 9 Part numbering For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. The category of Second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Table 23. Ordering information scheme Example: M24C32– W MN 6 T P /B Device Type M24 = I2C serial access EEPROM Device Function 128–B = 128 Kbit (16384 x 8) C64– = 64 Kbit (8192 x 8) C32– = 32 Kbit (4096 x 8) Operating Voltage W = VCC = 2.5 to 5.5V R = VCC = 1.8 to 5.5V F = VCC = 1.7 to 5.5V (1) 1. Device grade 5 is available only with the operating voltage option F. Package BN = PDIP8 MN = SO8 (150 mil width) DW = TSSOP8 (169 mil width) MB = UFDFPN8 (MLP8)(2) 2. The UFDFPN8 package is available in M24C32-x devices only. It is not available in M24C64-x devices. Device Grade 6 = Industrial: device tested with standard test flow over –40 to 85 °C 3 = Automotive: device tested with High Reliability Certified Flow(3) over –40 to 125°C. 3. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy. 5 = Consumer: device tested with standard test flow over –20 to 85°C(1) Option blank = Standard Packing T = Tape and Reel Packing Plating Technology blank = Standard SnPb plating P or G = ECOPACK® (RoHS compliant) Process B = F6DP26% Rousset P = F6DP26% Chartered |
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