Data Sheet S14680EJ1V0DS

11

µµµµ PD16702

7. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the

µ PD16702.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

µ PD16702N-xxx: TCP (TAB Package)

Mounting Condition

Mounting Method

Condition

Thermocompression

Soldering

Heating tool 300 to 350

°C, heating for 2 to 3 seconds : pressure 100g

(per solder)

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100

°C: pressure 3 to 8 kg/cm

2: time 3 to 5 sec.

Real bonding 165 to 180

°C: pressure 25 to 45 kg/cm

2: time 30 to 40 sec.

(When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite,Ltd).

Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.