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UPD16837GS Datasheet(PDF) 13 Page - Renesas Technology Corp |
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UPD16837GS Datasheet(HTML) 13 Page - Renesas Technology Corp |
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13 / 16 page ![]() µPD16837 11 Data Sheet S12764EJ2V0DS The switching characteristics shown on the preceding pages are specified as follows (“output at one side” means output B for H bridge output A, or output A for output B). [Rise time] Rise time when the output at one side is fixed to the low level (specified on current ON). [Fall time] Fall time when the output at one side is fixed to the high level (specified on current ON). [Rising delay time] Rising delay time when the output at one side is fixed to the low level (specified on current ON). [Falling delay time] Falling delay time when the output at one side is fixed to the high level (specified on current ON). [Change in rising delay time] Change (difference) in the rising delay time between when the output at one side is fixed to the low level and when the output at the other side is fixed to the high level. [Change in falling delay time] Change (difference) in falling delay time between when the output at one side is fixed to the low level and when the output at the other side is fixed to the high level. [Rising delay time differential] Difference in rising delay time between output A and output B. [Falling delay time differential] Difference in falling delay time between output A and output B. Caution Because this IC switches a high current at high speeds, surge may occur due to the VM and GND wiring and inductance and degrade the performance of the IC. On the PWB, keep the pattern width of the VM and GND lines as wide and short as possible, and insert the bypass capacitors between VM and GND at a location as close to the IC as possible. Connect a low-inductance magnetic capacitor (4700 pF or more) and an electrolytic capaci- tor of 10 µµµµµF or so, depending on the load current, in parallel. |
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