M25P64-VMF6TP datasheet(39/49 Pages) STMICROELECTRONICS

39 / 49 page

M25P64

Initial delivery state

39/49

Initial delivery state

The device is delivered with the memory array erased: all bits are set to 1 (each byte

contains FFh). The Status Register contains 00h (all Status Register bits are 0).

Maximum rating

Stressing the device outside the ratings listed in Table 9 may cause permanent damage to

the device. These are stress ratings only, and operation of the device at these, or any other

conditions outside those indicated in the Operating sections of this specification, is not

implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect

device reliability. Refer also to the STMicroelectronics SURE Program and other relevant

quality documents.

Table 9.

Absolute maximum ratings

Symbol

Parameter

Min.

Max.

Unit

TSTG

Storage Temperature

–65

150

°C

TLEAD

Lead Temperature during Soldering

See note (1)

Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®

7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)

2002/95/EU

°C

VIO

Input and Output Voltage (with respect to Ground)

–0.5

VCC +

0.6

VCC

Supply Voltage

–0.2

4.0

VPP

Fast Program/Erase Voltage

–0.2

10.0

VESD

Electrostatic Discharge Voltage (Human Body model) (2)

JEDEC Std JESD22-A114A (C1=100 pF, R1 = 1500

Ω, R2 = 500 Ω).

–2000

2000

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