LM317L

http://onsemi.com

2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input−Output Voltage Differential

40

Vdc

Power Dissipation

Case 29 (TO−92)

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 751 (SOIC−8) (Note 1)

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Internally Limited

160

83

Internally Limited

180

45

W

°C/W

°C/W

W

°C/W

°C/W

Operating Junction Temperature Range

−40 to +125

°C

Storage Temperature Range

−65 to +150

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. SOIC−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 23 for Thermal Resistance

variation versus pad size.

2. This device series contains ESD protection and exceeds the following tests:

Human Body Model, 2000 V per MIL STD 883, Method 3015.

Machine Model Method, 200 V.