MPM3612

– 22V, 1A, ULTRA-LOW IQ STEP-DOWN POWER MODULE

MPM3612 Rev. 1.0

MonolithicPower.com

3

3/15/2023

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2023 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

EN

Enable control pin. Pull this pin to logic high to enable MPM3612; pull it to logic low to

disable the part. Do not float this pin.

2

VIN

Supply voltage. The MPM3612 operates from a 3V to 22V input rail. A capacitor is required

to decouple the input rail. Use wide PCB traces and multiple vias for the VIN power trace

during PCB layout.

3

GND

System ground. This pin is the reference ground for the regulated output voltage (VOUT),

and requires special consideration during PCB layout.

4, 5

VOUT

Module voltage output node.

6

FB

Feedback. This pin sets VOUT when connected to the tap of an external resistor divider that

is connected between VOUT and GND.

7

PG

Power good output. This pin is an open drain that indicates whether the power is good (no

under-voltage [UV] or over-voltage [OV] fault).

8

VCC

Internal 3.3V LDO output. The driver and control circuits are powered by the voltage from

this pin.

NC1

NC1

Not connected.

NC2

NC2

Not connected.

Exposed

pad

-

Exposed pad. Connect to GND.

ABSOLUTE MAXIMUM RATINGS (1)

VIN, VEN, VOUT ................................-0.3V to +24V

VSW..... -0.3V (-5V < 10ns) to +24V (28V < 10ns)

VBST ...................................................... VSW + 4V

VPG .............................................................. 6.5V

All other pins ................................-0.3V to +4.3V

Continuous power dissipation (TA = 25°C) (2)

................................................................. 1.78W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

Recommended Operating Conditions (3)

Supply voltage (VIN) ............................3V to 22V

Output voltage (VOUT)............. 0.6V to VIN x DMAX

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4, 5, 6, 7)

LGA (3mmx3mmx2mm)

θJA…….….…..…..…..…..…..…..….....70.3°C/W

θJC_TOP…….….…..…..…..…..…..….....34.9°C/W

θJB…….….…..…..…..…..…..…..….....54.9°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4)

θ

JA is the junction-to-ambient thermal resistance, θJC_TOP is the

junction-to-case top thermal characterization parameter, and

θ

JB is the junction-to-board thermal characterization parameter.

5) The thermal parameter is based on test on the EVM3612-LQ-

00A evaluation board under no airflow cooling conditions in a

standard enclosure. The EVM3612-LQ-00A is a 6.4cmx6.4cm,

2-layer PCB, with a 2oz. top and bottom layer copper thickness.

6) The junction-to-case top thermal characterization parameter,

θ

JC_TOP, estimates the junction temperature in the real system,

based on TJ = θJC_TOP x PLOSS + TCASE_TOP, where PLOSS is the

module’s entire power loss in a real application, and T

CASE_TOP

is the case top temperature.

7) The junction-to-

board thermal characterization parameter, θ

JB,

estimates TJ in the real system, based on TJ = θJB x PLOSS +

TBOARD, where PLOSS is the module’s entire power loss in a real

application, and TBOARD is board temperature.