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MMDF2C03HD Datasheet(PDF) 1 Page - ON Semiconductor |
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MMDF2C03HD Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 10 page ![]() © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MMDF2C03HD/D MMDF2C03HD Preferred Device Power MOSFET 2 Amps, 30 Volts Complementary SO−8, Dual These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain-to-source diode has a very low reverse recovery time. MiniMOS t devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc-dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. Features • Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive − Can Be Driven by Logic ICs • Miniature SO-8 Surface Mount Package − Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • Diode Exhibits High Speed, With Soft Recovery • IDSS Specified at Elevated Temperature • Avalanche Energy Specified • Mounting Information for SO-8 Package Provided • Pb−Free Package is Available MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) (Note 1) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 30 Vdc Gate−to−Source Voltage VGS ± 20 Vdc Drain Current − Continuous N−Channel P−Channel Drain Current − Pulsed N−Channel P−Channel ID IDM 4.1 3.0 21 15 A Operating and Storage Temperature Range TJ, Tstg −55 to 150 °C Total Power Dissipation @ TA= 25°C (Note 2) PD 2.0 W Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 62.5 °C/W Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 30 V, VGS = 5.0 V, Peak IL = 9.0 Apk, L = 8.0 mH, RG = 25 W) N−Channel (VDD = 30 V, VGS = 5.0 V, Peak IL = 6.0 Apk, L = 18 mH, RG = 25 W) P−Channel EAS 324 324 mJ Max Lead Temperature for Soldering, 0.0625 ″ from case. Time in Solder Bath is 10 seconds TL 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Negative signs for P−Channel device omitted for clarity. 2. Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10 sec. max. N−Source 1 2 3 4 8 7 6 5 N−Gate P−Source P−Gate N−Drain N−Drain P−Drain P−Drain Device Package Shipping† ORDERING INFORMATION MMDF2C03HDR2 SO−8 2500 Tape & Reel N−Channel D S G PIN ASSIGNMENT Preferred devices are recommended choices for future use and best overall value. D S G P−Channel 2 AMPERES, 30 VOLTS RDS(on) = 70 mW (N-Channel) RDS(on) = 200 mW (P-Channel) http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. MMDF2C03HDR2G SO−8 (Pb−Free) 2500 Tape & Reel SO−8 CASE 751 STYLE 14 MARKING DIAGRAM D2C03 = Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) D2C03 AYWW G G 1 8 1 8 |
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